Parameter specification MI-2000B LI-2000
Inspection items: missing parts, multiple parts, solder ball, offset, side standing, stele standing, reverse pasting, wrong parts, broken parts, bridging, faulty soldering, less tin, more tin, IC pin floating, IC pin bending, OCR, OCV (character recognition)
Vision system Industrial camera 2M pixel color digital camera
Lighting system High brightness RGB three color light source lighting, intelligent light emphasis
Resolution 10~20um (continuously adjustable)
FOV size 32 * 24mm (resolution: 20um)
Image taking and operation time 4-5FOV/sec 250ms/FOV
Motion system X/Y axis drive system AC servo drive system, precision ball screw, slide rail, positioning accuracy± 5um,0-80mm/sec
Thickness of transport track base plate 0.6~3mm
Adapt to substrate bending/- 2mm
Above the upper and lower clear height of applicable base plate: 30mm; below: 40mm
PCB handling height 900± 20mm
Track reference and substrate flow are fixed forward/backward; Left in right out/right in left out (according to customer requirements before delivery)
Applicable substrate size: 50 * 50~330 * 250mm Applicable substrate size: 50 * 70~510 * 460mm
Overall dimension width: 710mm; length: 795mm; height: 1650mm; width: 1140mm; length: 1120mm; height: 1660mm
Equipment weight is about 260kg, about 850kg
Power supply specification: single-phase AC 220V± 10%, 50/60HZ, - large load power consumption 1.5KVA single-phase AC 220V± 10%, 50/60HZ, - large load power consumption 1.8KVA
Air pressure requirement 0.5 MPa
Environmental requirements: temperature 5~40 ℃, relative humidity 25%~80%, no frost
Standard SMEMA interface of communication mode
Option barcode identification, offline programming software, maintenance station, SPC data server
