SPI HS60 (superprime) series is the fastest online solder paste detection system in the market. The measuring speed is 100cm2/sec at 13x13um resolution and 80cm2/sec at 10x10um resolution. It can check pads smaller than 01005 and the size is as small as 100um. Based on the RSC-6 sensor developed by PARMI, the HS60 detection cycle time is greatly reduced. In addition, the camera lens used for the RSC sensor has two magnifications - 0.42x to 0.6x magnification, giving engineers more control. Main features of 3D sensor "RSC VI"

Best speed, best resolution

100 ｜/s @ 13x13um spatial resolution and RSC VI

80 ｜/s @ 10x10um spatial resolution and RSC VI

Double laser projection shadowless

Real time PCB warpage tracking and warp measurement

True 3D shapes and color 2D images

HS60 (supreme) maximum measuring plate 390 * 260MM

Hs60L (superpime) maximum measuring plate 550 * 510MM

Stable operation and long life

The PARMI laser head is installed on the linear motor to provide stable continuous movement and higher stability, and eliminate the impact of vibration on the precision measurement height, area, volume and warpage. This is in contrast to other systems on the market that use stepper motors and the "stop/turn" motion function that results in vibration and inaccurate results due to rapid acceleration and braking. Due to the stable movement of the laser head, the PARMI linear motor has a longer service life.

Shenzhen Lizhifeng Electronic Equipment Co., Ltd., HS60 Deloitte SPI CKDSPI Styker SPI Meilu SPI and other MV-11 have a large number of AOI and X-RAY rentable and saleable hotlines 13925286095